Tepelné - tepelné jímky

HEAT SINK 37.5 X 37.5 X 19.5MM. Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 37.5x37.5x19.5mm, 65.2mm Fin Tip

RASPBERRY PI COPPER HEATSINK. DFRobot Accessories Self-adhesive Pure Copper Heatsink

HEATSINK W/CLIP FOR TO-264. Heat Sinks HTSNK TO-264 AUTOCLP BLK ANODIZED

SUPERGRIP HEATSINK 35X35X17.5MM. Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 35x35x17.5mm

HEATSINK 3X1.5X5 SSR/IGBT/POWER. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x38.1x127mm, 4 Mounting Holes

TO-263 HEAT SINK ANODZD.

HEATSINK FOR TO-247 WITH 1 CLIP. Heat Sinks HEATSINK FOR TO-247 1 CLIP, RADIAL

HEATSINK CPU W/ADHESIVE 1.61SQ.

HEATSINK 30X30X25MM R-TAB CP.

PH3N NANO 50.8X12.07X0.062MM.

HEATSINK CER 30.5X30.5X6MM W/TAP.

HEATSINK TO-5 2W BLK.

1/8 BRICK HEATSINK 23X59X11.4MM. Heat Sinks maxiFLOW Power Brick Heatsink, Eighth Brick, Gold-Anodized, T766, Hardware, 23x58x11.4mm

HEAT SINK 25MM X 25MM X 4MM. Heat Sinks maxiFLOW BGA ASIC Cooling Heatsink, High Performance, No TIM, 25x25x4mm

HEATSINK TO-247 TO-264 TO-220.

HEAT SINK 23MM X 23MM X 17.5MM. Heat Sinks maxiFLOW Heatsink with maxiGRIP Attachment, T766, Blue-Anodized, 23x23x17.5mm

HEATSINK 54X54X25MM XCUT CP.

HEATSINK 25X25X15MM L-TAB T766.

HEATSINK 35X35X12MM PIN. Heat Sinks Chipset Heatsink with Clip, Pin Fin, 35mm Chip Size, 11.6mm Height, Aluminum, Black Anodized

HEAT SINK 40MM X 40MM X 19.5MM. Heat Sinks BGA Heatsink, High Performance X-CUT, Square Pin Fins, Double-Sided Thermal Tape, Black-Anodized, 40x40x19.5mm