Wakefield-Vette

Wakefield-Vette LQxC Series quick disconnect couplings provide ultra-reliable, dripless connections and disconnections that protect valuable electronics.

Wakefield-Vette 690 series extruded heat sinks for TO devices with clip are heat sinks designed for TO-126, TO-220, and TO-247 devices.

Wakefield-Vette RAPID CPU Coolers are designed to draw heat away from the system CPU and other components in an enclosure.

Wakefield-Vette SKV Skived Fin Heat Sinks are the alternatives to extruded heat sinks considering the fin density, which cannot be achieved by extrusion technology.

Wakefield-Vette RAPID CPU Liquid Coolers are designed to draw heat away from the system CPU and other components in an enclosure.

Wakefield-Vette TECA Air-to-Air Thermoelectric Cooler Assemblies are usually used to cool (or heat) objects in enclosures.

Wakefield-Vette 960 Series Plastic Push Pin Heat Sinks feature pre-assembled plastic push pins with a flexible barb that engage precisely with PCB holes.

Wakefield-Vette TEC Series Thermoelectric Cooler Modules meet requirements of higher currents and larger cooling.

Wakefield-Vette TECA Air-to-Plate Thermoelectric Cooler Assemblies deliver compact and reliable cooling in a range from 42W to 80W.

Wakefield-Vette ulTIMiFlux™ Thermally Conductive Gap Filler is composed of an ultra-soft thermally conductive silicone supplied as a two-component liquid dispensable material.

Wakefield-Vette Full, Half, and Quarter Brick DC/DC Heatsinks are available in various fin heights, sizes, and orientations to best match a variety of applications.

Wakefield-Vette BondaTherm™ Equalizer Kits are epoxy kits that eliminate improper ratios and mixing errors commonly found with other epoxy combinations.

Wakefield-Vette ulTIMiFlux Thermal Material offers high performance, low cost, configurability and custom sizes for thermal system needs.